With its extremely compact package, the CC is designed for 80 mm ID targets, making it an excellent choice for small systems or R&D systems.

TECHNICAL DATA:
• Power: 20 kW DC or MFAC
• V/A: 1500 V/50 A
• Target: Up to 1000 mm
• Thickness: 122 mm

The industry-standard size SC-Series, internal mount end block is the lowest cost, highest power, and most reliable end block available.

TECHNICAL DATA:
• Power: Up to 200 KW DC or 80 KHz MFAC
• V/A: 1000 V/450 A
• Target: Up to 4000 mm
• Average weight: 40 kg

The MC-Series, internal mount end block provides high performance and reliability in a compact design.

TECHNICAL DATA:
• Power: Up to 100 KW DC or 80 KHz MFAC
• V/A: 1000 V/225 A
• Target: Up to 2500 mm
• Average weight: 20 kg

The TC-Series, internal mount end block combines high-performance and reliability in our most compact design.

TECHNICAL DATA:
• Power: Up to 40 KW DC or 80 KHz MFAC
• V/A: 1000 V/100 A
• Target: Up to 1500 mm
• Average weight: 10 kg

The SM-Series external mount end block uses the same patented technology as our SC-Series end block to deliver outstanding value, performance and reliability.

TECHNICAL DATA:
• Power: Up to 200 KW DC or 80 KHz MFAC
• V/A: 1500 V/450 A
• Target: Up to 4000 mm
• Average weight: 60 kg

The MM-Series external mount end block uses the same patented technology as our MC-Series end block to deliver outstanding value, performance and reliability in a compact design.

TECHNICAL DATA:
• Power: Up to 100 KW DC or 80 KHz MFAC
• V/A: 1500 V/225 A
• Target: Up to 2500 mm
• Average weight: 30 kg

The CM-Series external end block combines high-performance and reliability in a very compact and lightweight design. Available also with smaller mounting flange for 80 mm ID target. Therefore the CM end block fits perfectly for systems with smaller space requirements.

TECHNICAL DATA:
• Power: Up to 20 KW DC or 80 KHz MFAC
• V/A: 1500 V/50 A
• Target: Up to 1000 mm
• Average weight: 15 kg

The Swing Cathode end block uses the same patented technology as our SM-Series and MM-Series end block to deliver outstanding value, performance and reliability.
Also available with CM-Series and blocks.

TECHNICAL DATA:
• Power: Up to 200 (100) KW DC or 80 KHz MFAC
• V/A: 1500 V/450 (225) A
• Target: Up to 4000 mm (2500 mm)
• Average weight: 15 kg

Swing-DUO™ (Dynamic Uniformity Optimization) software is designed to simulate the combined cathode array uniformity for individually optimized motion profiles used to control the motion of the SCI magnet bars when used with our exclusive Swing Cathode™.

Our Magnetics are designed to provide high quality, uniform coatings for your application.

Sputtering Components’ Remotely Adjustable Magnet Bar or RAM-Bar™ allows customers to adjust the distance between the magnets and the target surface from outside the system during operation. Also available with CM-Series and blocks.

TECHNICAL DATA:
• Min BT Lenght: 1 m
• Max Target Diameter: 180 mm
• Adjuster Pitch: 12″ / 305 mm
• Adjustable Uniformity: +/- 1% depending on application
• Application: Optical Thin Films with Tight Uniformity Requiements

We designed the Air Retractable Magnet Bar (ARM-Bar™) for sputtering ferromagnetic materials: alloys of iron, cobalt and a few “rare-earth” elements.
With the magnet bar raised and lowered using air bladders, the ARM-Bar™ provides the utilization and up-time benefits of a rotary cathode while allowing safe and easy insertion into the target, adjustment and removal.
In order to penetrate the magnetic material, the ARM-Bar™ has our strongest magnet bar, the QRM-Bar™.
Typical applications include EMI shielding, nickel sputtering as an adhesion layer for polyimide substrates, and magnetic storage.

The e-Cathode™ is a complete cathode solution. SCI e-Cathode™ systems are available in digital and analog styles and are adaptable to meet your needs.
SCI provides OEM equipment builders complete turn-key solutions, ready to interface with their systems. SCI can customize these solutions to provide as much controls integration as desired onboard the e-Cathode™. End users seeking to add additional cathodes to their system look to SCI for plug-and-play solutions. Our e-Cathode clones match all your current external mechanical and electrical interfaces but use SCI end blocks, magnet bars, and cathode control systems.

IONIX® round magnetrons are available in target diameters of 1.25” to 10” and include standard KF/ISO interfaces for use with virtually any type of vacuum chamber installation.

IONIX® rectangular magnetron sputtering sources with advanced water cooling circuits are designed for industrial production purposes, offering:
• High-reate metallic sputtering
• RF sputtering of dielectric targets
• Pulsed reactive mode sputtering for high rate
• Deposition of dielectric thin films

robeko provides products of Seren IPS Inc., a leading manufacturer of RF power delivery components.
At Seren IPS. Inc., innovative technology, applications and design expertise are combined with world class support to deliver critical RF power solutions including RF Generators, Matching Networks and accessories. Continuous product development and dedicated Application/Design Engineering services ensure success for our customers.

Seren “HR Series” products incorporate a separate surface mount technology printed circuit board for controls and RF amplifier. The RF amplifier is powered by a switch-mode power supply.
Seren “HR Series” products utilize LDMOS Field-Effect Transistors in the power amplifier stages. The unit operates in a class AB mode providing
power accuracy and stability across the entire power range.

• AT Series (Industrial Applications/Sputter/Etch/Deposition)
• ATS Series (Semiconductor/Sputter/Etch/Deposition/ALD)

Magpuls Pulse Power supplies provide highest flexibility and supreme performance for plasma nitriting processes, bias applications and magnetron sputtering including ambitious reactive and HIPIMS processes.
The MAGPULS Unipolar and Bipolar Pulse Power Supply series MP 1, MP 2 and MP 2 – HC are constructed in two separate units. One unit is the DC power supply which provides the DC power into the big capacitor bank of the pulse unit and the pulse unit with the integrated sophisticated ARC Management.

The unipolar pulsed Power Supplies are designed in modular technology. The main components of these power supplies are the DC-Power supply and the pulsing unit which generate the pulsed output voltage with adjustable pulse frequency in the range from DC up to 100kHz. The Arc-management with highest efficiency is adjustable for all different Plasma treatment processes and grants a proper layer quality without any layer damages on the surface.

The bipolar pulsed power supplies model MAGPULS BP are constructed for plasma excitation with highest performance. The bipolar pulsed power supply is a modular designed system consisting of the DC power unit and the bipolar pulse unit, which switches the voltage with a freely adjustable pulse of alternating polarity into the plasma system.

The MAGPULS Bipolar Pulse Power supplies series MP 2 -AS are designed for operating with dual magnetrons for reactive sputtering on substrates as for glass, plastics and metal. The individual operating modes and the enhanced ARC-management allows the bipolar pulse power supplies operation in high quality processes. Typical applications are production of flat panel displays, solar cells, decorative and hard coatings.

Thanks to the short extremely high peak current pulses the pulse power supplies model MAGPULS HPP generate plasma intensity with highest density which leads to an excellent coating quality in high-pulse sputtering (HIPIMS).
Excellent film properties in terms of wear resistance, adhesive strength, hardness and homogeneity.
Easy integration in existing magnetron sputter systems.

The EMICON MC systems are qualified for most applications in plasma technology for analyzing the plasma, for optimizing the process, for plasma monitoring, for quality control and for process controlling. The turn-key EMICON MC systems come with all features necessary for monitoring common plasma processes and for communicating via analog and digital outputs with the application control.

The EMICON SA systems are especially designed for process control and quality assurance in industrial plants and production lines. The integrated processor unit ensures stand-alone operation in 24/7 mode and easy integration of the EMICON SA system into the system conrol by e.g. LAN or Profibus.

The EMICON HR system is a high-resolution spectrometer system and it is especially qualified for detailed spectral plasma analysis and plasma monitoring but also for quality control and process controlling. The single channel EMICON HR system comes with all features necessary for monitoring and anaylzing process plasmas in detail.

Optical components are the interface between the application process and the detection system: The optics should transfer as much light intensity as possible and it should be flexible and resistant to industrial environments.

PLASUS SpecLine is the most powerful software tool for evaluating your spectral data. The worldwide unique database for atoms and molecules makes line identification fast and easy.

The MIRO 200 CI.

Aura-Wave has been designed to be self-adapted once the plasma ignited. A magnetic field combined to the electromagnetic wave allows the creation of plasma at low pressure – range of 10-3 mbar.

The MIRO 200 CI.

The envis-ION™ Dual Magnetron Pretreatment Source has a wide range of operation for improved adhesion and durability.

TECHNICAL DATA:
• Max Power: 5 KW/m
• Typical Power: 2-4 KW/m
• Operating Pressure: 1-40 m Torr
• Pet Surface Energy at 6.7 m/min: > 65 Dynes

Aura-Wave has been designed to be self-adapted once the plasma ignited. A magnetic field combined to the electromagnetic wave allows the creation of plasma at low pressure – range of 10-3 mbar.

IONICS has developed the HARDION industrial ion gun solution solving different technical and economic issues generally associated to the process. Enhance the surface properties of your material without any coatings and using an environmentally friendly technology. The innovation is supported by a Walloon initiative called WALIBEAM and several industrial majors in the fields of surface treatment of glass, metal and polymer are involved.

Surface modifications, to improve a specific function of an object, have limited robustness. Our Ion implantation technologies (based on Quertech-Ionics ECR sources) open the way to innovative and lasting surface functional products.

robeko provides a wide range of high performance thin film coating materials for magnetrons of all manufacturers and a large variety of applications, for example large area coating, precision optics, touch panels, tribological and decorative coatings.
Our supply chain consists of own manufacturing capabilities combined with long-term partnerships to assure maximum quality, minimal lead times and highly competitive prices.

robeko manufactures planar and cylindrical sputtering targets for application in electronics and display production. We provide cylindrical monolithic targets of industrial standard size. Thus we guarantee maximum material density, small grain size and maximum power density combined with good recyclability. The raw material is always on stock.

robeko supplies high quality materials such as hipped chromium targets with purity grades ranging from 99.5 to 99.99 %.

robeko supplies high quality aluminium targets with purity grades ranging from 99.2 to 99.9999 %.

robeko supplies high quality Ti targets with purity grades ranging from 99.2 (grade 1–2) to 99.99 % and Ti alloys like TiAl36/TiAl50.

Many sputtering targets must be bonded to a backplate or magnetron heatsink. In the area of ​​high sputtering performance, the proper bonding process is essential to ensure the mechanical stability of the target to counteract cracking, deformation, and delamination.

Many sputtering targets need to be bonded to a backing plate or a magnetron body. When it comes to high power sputtering with low target cracking and good mechanical stability, the bonding procedure is crucial. Our engineers and bonding staff can look back on many years of experience in providing joining techniques to correlate with different material combinations and applications. The right choice of adherence coating, diffusion barriers and the adequate bonding method is a prerequisite for obtaining perfect results.

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Erika – Batch Coater

• DC glow discharge plasma treatment
• 3x 6″ Magnetrons
• DC, bipolar pulsed and unipolar pulsed power supplies
• Metallic and reactive oxide and nitride coatings

Doro — In-Line Coater

• Radiant heater -350° C
• DC glow discharge plasma treatment
• AC glow discharge plasma treatment
• SCI Dual Magnetron Plasma Treatment
• 3x PK 750 Magnetrons
• 2x SCI internal mount TC end blocks for 550 mm length dual rotatable targets
• DC, MF, bipolar pulsed and unipolar pulsed power supplies
• Metallic and reactive oxide and nitride coatings
• In-Situ reflectometry measurement

Stella -Batch & Bulk Ware Coater

• AC glow discharge plasma treatment
• 2x PK 500 Magnetrons
• DC and unipolar pulsed power supplies
• Metallic and reactive oxide and nitride coatings
• Bulk ware coating in tumble drum

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The Fischerscope XDAL is an x-ray fluorescence (XRF) measurement tool for industrial applications. XRF works by exciting the sample material and detecting the characteristic x-ray emission coming from the sample. The collected data can be used to calculate the material composition or the thickness of a multilayer thin film layer stack of a sample. A motorized XYZ unit allows measurement of profiles or x-y film thickness mappings.

The SE 801 Ellipsometer is a tool for measuring the optical properties (complex refractive index, film thickness) by measuring the change of polarization upon reflection of polarized light and comparing those measurements to a model.

The Bruker Dektak II A is a tactile profilometer for measuring surface roughness or film thickness on prepared samples.
Tactile profilometers measure the force against a small needle and that is moved lateral to the sample. This force is kept constant by changing the position of that needle via a small piezo in Z direction. The piezo movement is logged and gives a height profile of the sample.